IC Package Technical Lead (W/M)

RHESO.TECH

Paris (75)CDI
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Description du poste

IC Package Technical Lead (W/M)


Recruiting Company:
French fabless semiconductor manufacturer specialized in the design and marketing of highly integrated, mixed-signal semiconductor products for markets demanding wideband and low power analog-to-digital, digital-to-analog conversion.

Role:
A dynamic and experienced IC package technical lead to drive all package related activities with our assembly partners, including the choice and materials development, to create outstanding products in a dynamic environment.

Responsibilities:
  • Serve as focal point for all packaging-related matters.
  • Collaborate closely with assembly centers and the design/R&D team to define and specify IC packages.
  • Work with the IC design team to define and/or design reliable BGA package substrates using CAD tools.
  • Prepare documentation for BGA substrate design approval and first procurement under QA policy.
  • Lead the selection of advanced packaging materials with standard and innovative solutions to meet total product package performance requirements across product application domains.
  • Conduct feasibility studies for early assessment of substrate technology and electrical performances.
  • Collaborate with assembly center R&D teams for continuous improvement of design performance.
  • Execute and/or drive Electrical, Thermal and Mechanical Modeling in collaboration with assembly partners.
  • Contribute to the integration of solutions into customer applications on packaging-related aspects and the implementation of thermal dissipation systems.

Requirements:
  • You hold an MSc in Electrical Engineering or equivalent, with over 5 years hands-on experience in defining, selecting, and qualifying IC packages, strongly understanding of IC package assembly development process.
  • You demonstrate expertise in high-performance Flip-Chip BGA packaging for large-scale, high-speed/power IC.
  • You have experience evaluating impact of packaging on PCB design, board, system integration, high-speed, RF.
  • You excel at system-level thermal dissipation technologies: through board, heat spreader, heat sink, fan.
  • Your pluses: thermal simulation, RF, die-to-die interconnect Technologies, design tools, French language.
  • You demonstrate analytical and problem-solving skills, are a team player with a critical attitude and sense of initiative, communicate fluently in oral and written English, are ready to travel occasionally to assembly lines.


Education:
BAC+5, Master's Degree

RHESO.TECH, a specialized recruitment agency
https://www.rheso.tech/

Key words: IC, Package, IC Package, Assembly, Design, BGA, CAD, PCB, RF

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